Electrical and Electronic Components
Power Tools
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Material: PA6.
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Adjustable glass-fiber content: 10-60% in the B2G15-60 range.
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Good weatherability, color stability and low-temperature performance.
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High hardness and stiffness, wear resistance, fatigue resistance and dimensional stability.
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Injection-molding grade: B2BK.
Coil Bobbins
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A60G25NC/BK and AT60G25NC/BK: red-phosphorus flame-retardant PA66 with 25% glass fiber.
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Key requirements: heat resistance, stiffness, UL 94 V-0 and UL 1446 Class B.
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Benefits: electrical insulation and low phosphine emissions.
Timers
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A90GV30NC/BK: halogen-free flame-retardant PA66 with 30% glass fiber.
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Key requirements: heat resistance, stiffness and UL 94 V-0.
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Glow-wire ignition temperature: GWIT 800°C.
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Benefits: heat resistance, dimensional stability and halogen-free formulation.
USB Type-C Connector Housings
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Material: glass-fiber-reinforced, brominated flame-retardant PPA.
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Adjustable glass-fiber content: 10-50%.
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Excellent creep resistance and RTI above 150°C.
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Heat deflection temperature up to 270°C, high flow and shorter molding cycles.
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Suitable for 270°C reflow soldering; stable UL 94 V-0 performance at 0.8 mm.
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Stable glow-wire performance without flaming.
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CTI range: 250-350 V.
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Designed to support UL 746C and IEC 60695 requirements.
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Recommended grade range: H50G10-50; all colors available.
RJ45 Connectors
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Material: glass-fiber-reinforced, halogen-free flame-retardant PPA.
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Adjustable glass-fiber content: 10-50%.
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Custom colors and laser-marking capability; RTI above 150°C.
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Heat deflection temperature up to 270°C, high flow and shorter molding cycles.
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Suitable for 270°C reflow soldering; stable UL 94 V-0 performance at 0.8 mm.
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Halogen- and red-phosphorus-free; designed for WEEE and RoHS compliance.
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Designed to support UL 746C and IEC 60695 requirements.
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High CTI range: 550-600 V and strong arc resistance.
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Recommended grade range: H90G10-50; all colors available.
USB 3.0 Type-A Receptacle Housings
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Material: glass-fiber-reinforced, halogen-free flame-retardant PPA.
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Adjustable glass-fiber content: 10-50%.
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Custom colors and laser-marking capability; RTI above 150°C.
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Heat deflection temperature up to 270°C, high flow and shorter molding cycles.
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Suitable for 270°C reflow soldering; stable UL 94 V-0 performance at 0.8 mm.
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Halogen- and red-phosphorus-free; designed for WEEE and RoHS compliance.
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Designed to support UL 746C and IEC 60695 requirements.
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High CTI range: 550-600 V and strong arc resistance.
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Recommended grade range: H90G10-50; all colors available.
Mobile Device Frames
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Material: glass-fiber-reinforced PPA.
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Glass-fiber content: 30-60%.
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Excellent creep resistance and long-term use temperature above 150°C.
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Heat deflection temperature up to 270°C, high flow and shorter molding cycles.
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High hardness and stiffness, wear and fatigue resistance, low water absorption and strong dimensional stability.
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Recommended grade range: H2G10-50; all colors available.